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| MOTOROLA SEMICONDUCTOR TECHNICAL DATA 1-of-8 Decoder/Demultiplexer with LSTTL Compatible Inputs High-Performance Silicon-Gate CMOS The MC74HCT138A is identical in pinout to the LS138. The HCT138A may be used as a level converter for interfacing TTL or NMOS outputs to High Speed CMOS inputs. The HCT138A decodes a three-bit Address to one-of-eight active-lot outputs. This device features three Chip Select inputs, two active-low and one active-high to facilitate the demultiplexing, cascading, and chip-selecting functions. The demultiplexing function is accomplished by using the Address inputs to select the desired device output; one of the Chip Selects is used as a data input while the other Chip Selects are held in their active states. * * * * * * Output Drive Capability: 10 LSTTL Loads TTL/NMOS Compatible Input Levels Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 4.5 to 5.5 V Low Input Current: 1.0 A In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity: 122 FETs or 30.5 Equivalent Gates LOGIC DIAGRAM A0 ADDRESS INPUTS A1 A2 1 2 3 15 14 13 12 11 10 9 7 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 ACTIVE-LOW OUTPUTS MC74HCT138A N SUFFIX PLASTIC PACKAGE CASE 648-08 1 16 16 1 D SUFFIX SOIC PACKAGE CASE 751B-05 DT SUFFIX TSSOP PACKAGE CASE 948F-01 16 1 ORDERING INFORMATION MC74HCTXXXAN MC74HCTXXXAD MC74HCTXXXADT Plastic SOIC TSSOP PIN ASSIGNMENT A0 A1 A2 CS2 CS3 CS1 Y7 GND 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC Y0 Y1 Y2 Y3 Y4 Y5 Y6 FUNCTION TABLE CHIP- SELECT INPUTS CS1 CS2 6 4 5 PIN 16 = VCC PIN 8 = GND X X L H H H H H H H H X H X L L L L L L L L Inputs H X X L L L L L L L L X X X L L L L H H H H X X X L L H H L L H H X X X L H L H L H L H H H H L H H H H H H H H H H H L H H H H H H H H H H H L H H H H H Outputs H H H H H H L H H H H H H H H H H H L H H H H H H H H H H H L H H H H H H H H H H H L H H H H H H H H H H H L CS1CS2 CS3 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 10/95 (c) Motorola, Inc. 1995 IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II III I I IIIIIIIIIIIIIII I IIIIIIIIIIIIIII II III I II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII IIIIIIIIIIIII I IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII IIIIIIIIIIIII I IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II CS3 Design Criteria Value 30.5 1.5 5.0 Units ea. ns Internal Gate Count* Internal Gate Propagation Delay Internal Gate Power Dissipation Speed Power Product W pJ .0075 *Equivalent to a two-input NAND gate. 1 H = high level (steady state) L = low level (steady state) X = don't care REV 6 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I III I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I I I I I III I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I III I I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII I I I I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I II I III I I I I I I III I I I I IIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII III I III I I III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C TSSOP Package: - 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I IIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII MAXIMUM RATINGS* MOTOROLA DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) RECOMMENDED OPERATING CONDITIONS MC74HCT138A Symbol Vin, Vout Symbol Symbol VCC Vout Tstg ICC Iout VCC Vin PD ICC TL VOH tr, tf Iin VOL ICC TA VIH VIL Iin Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, TSSOP or SOIC Package) Storage Temperature Power Dissipation in Still Air DC Supply Current, VCC and GND Pins DC Output Current, per Pin DC Input Current, per Pin DC Output Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Supply Voltage (Referenced to GND) Input Rise and Fall Time (Figure 1) Operating Temperature, All Package Types DC Input Voltage, Output Voltage (Referenced to GND) DC Supply Voltage (Referenced to GND) Additional Quiescent Supply Current Maximum Quiescent Supply Current (per Package) Maximum Input Leakage Current Maximum Low-Level Output Voltage Minimum High-Level Output Voltage Maximum Low-Level Input Voltage Minimum High-Level Input Voltage Parameter Parameter Parameter Plastic DIP SOIC Package TSSOP Package Vin = 2.4 V, Any One Input Vin = VCC or GND, Other Inputs lout = 0 A Vin = VIH or VIL |Iout| 4.0 mA Vin = VIH or VIL |Iout| 20 A Vin = VIH or VIL |Iout| 4.0 A Vin = VIH or VIL |Iout| 20 A Vin = VCC or GND Iout = 0 A Vin = VCC or GND Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A v v v v v v Test Conditions - 0.5 to VCC + 0.5 - 0.5 to VCC + 0.5 - 65 to + 150 - 0.5 to + 7.0 2 - 55 Min 4.5 Value 0 0 50 25 20 260 750 500 450 + 125 VCC Max 500 5.5 VCC V 5.5 5.5 6.0 4.5 4.5 5.5 4.5 4.5 5.5 4.5 5.5 4.5 5.5 Unit mW Unit mA mA mA _C _C _C ns V V V V V - 55_C - 55 to 25_C 0.1 0.26 3.98 2.9 4.0 0.1 0.1 4.4 5.4 0.8 0.8 2.0 2.0 This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Guaranteed Limit v 85_C v 125_C High-Speed CMOS Logic Data DL129 -- Rev 6 1.0 0.33 3.84 0.1 0.1 4.4 5.4 0.8 0.8 2.0 2.0 25_C to 125_C 40 v 2.4 1.0 160 0.4 0.1 0.1 3.7 4.4 5.4 0.8 0.8 2.0 2.0 v Unit mA A A V V V V IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I I I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I I I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High- Speed CMOS Data Book (DL129/D). High-Speed CMOS Logic Data DL129 -- Rev 6 Symbol tPLH, tPHL tPLH, tPHL tPLH, tPHL tTLH, tTHL CPD tr, tf Cin Maximum Input Capacitance Maximum Input Rise and Fall Time Maximum Output Transition Time, Any Output (Figures 2 and 4) Maximum Propagation Delay, CS1 to Output Y (Figures 2 and 4) Maximum Propagation Delay, Input A to Output Y (Figures 1 and 4) CS1 CS2 CS3 A2 A1 A0 6 4 5 3 2 1 Parameter * Used to determine the no-load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). AC ELECTRICAL CHARACTERISTICS (VCC = 5.0 V 10%, CL = 50 pF, Input tr = tf = 6.0 ns) Power Dissipation Capacitance (Per Enabled Output)* Maximum Output Transition Time, CS2 or CS3 to Output Y (Figures 3 and 4) EXPANDED LOGIC DIAGRAM 3 - 55 to 25_C 500 Typical @ 25C, VCC = 5.0 V 10 15 30 27 30 Guaranteed Limit v 85_C 500 10 19 38 34 38 51 10 15 14 12 13 11 7 9 Y7 Y6 Y5 Y4 Y3 Y2 Y1 Y0 MC74HCT138A v 125_C 500 10 22 45 41 45 MOTOROLA Unit pF pF ns ns ns ns ns MC74HCT138A SWITCHING WAVEFORMS VALID 1.3 V GND tPLH 1.3 V tPHL OUTPUT Y tTHL VALID 3V INPUT A INPUT CS1 tPHL 90% 1.3 V 10% tTLH tr 2.7 V 1.3 V 0.3 V tPLH tf 3V GND OUTPUT Y Figure 1. Figure 2. tr INPUT CS2, CS3 tPHL OUTPUT Y tTHL 90% 1.3 V 10% 2.7 V 1.3 V 0.3 V tf 3V GND tPLH tTLH Figure 3. TEST CIRCUIT TEST POINT OUTPUT DEVICE UNDER TEST CL* * Includes all probe and jig capacitance Figure 4. MOTOROLA 4 High-Speed CMOS Logic Data DL129 -- Rev 6 MC74HCT138A OUTLINE DIMENSIONS N SUFFIX PLASTIC PACKAGE CASE 648-08 ISSUE R B 1 8 -A - 16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MILLIMETERS MIN MAX MIN MAX 0.740 0.770 18.80 19.55 6.35 0.250 0.270 6.85 3.69 0.145 0.175 4.44 0.39 0.015 0.021 0.53 1.02 0.040 0.070 1.77 0.100 BSC 2.54 BSC 0.050 BSC 1.27 BSC 0.21 0.008 0.015 0.38 2.80 0.110 0.130 3.30 7.50 0.295 0.305 7.74 0 0 10 10 0.020 0.040 0.51 1.01 F S C L -T - H G D 16 PL 0.25 (0.010) M SEATING PLANE K J TA M M -A - 16 9 D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE J -B - 1 8 P 8 PL 0.25 (0.010) M B M G F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 BSC 0.25 0.19 0.25 0.10 7 0 6.20 5.80 0.50 0.25 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.229 0.244 0.010 0.019 K C -T SEATING - PLANE R X 45 M D 16 PL 0.25 (0.010) M J T B S A S High-Speed CMOS Logic Data DL129 -- Rev 6 5 MOTOROLA MC74HCT138A OUTLINE DIMENSIONS DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948F-01 ISSUE O 16X K REF 0.10 (0.004) 0.15 (0.006) T U S M TU S V S K K1 2X L/2 16 9 J1 B -U- L PIN 1 IDENT. 1 8 SECTION N-N J N 0.25 (0.010) 0.15 (0.006) T U S A -V- N F DETAIL E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ C 0.10 (0.004) -T- SEATING PLANE H D G DETAIL E Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 MFAX: RMFAX0@email.sps.mot.com -TOUCHTONE (602) 244-6609 INTERNET: http://Design-NET.com JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Toshikatsu Otsuki, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-3521-8315 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 MOTOROLA CODELINE 6 *MC74HCT138A/D* EEC CC EEC CC EEC CC EEC CC M -W- DIM A B C D F G H J J1 K K1 L M MC74HCT138A/D High-Speed CMOS Logic Data DL129 -- Rev 6 |
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